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基于虚拟样机技术的硅片磨床进给系统机电协同仿真

Electromechanical Collaborative Simulation for Feed System of Wafer Grinder Based on the Virtual Prototyping Technology

作者: 专业:机械制造及其自动化 导师:康仁科 年度:2010 学位:硕士  院校: 大连理工大学

Keywords

Wafer grinder, Feeding system, PID parameter, Motion simulation, Co-simulation

        硅片是目前制造集成电路芯片中重要的衬底材料。在IC芯片制程中,超精密磨削技术主要用于硅片制备中的平整化加工和后道制程中的硅片背面减薄加工。随着IC芯片不断向高集成化和高性能化方向的发展,在获得超光滑无损伤的表面质量且兼顾磨削效率方面,给超精密硅片磨床提出了新的挑战。超精密进给系统是硅片磨床中的关键部件,是一种具有复杂结构的机电产品。为提高硅片磨床的加工性能和运动精度,其进给系统必须具有良好的结构静、动态性能。本文综合运用虚拟样机、有限元分析和机电协同仿真等技术对进给系统的动态性能进行分析。论文的主要研究的内容如下:1.介绍了硅片磨床的研究现状,进给系统的性能要求以及虚拟样机技术和机电协同仿真技术的研究现状与发展趋势。2.分析了硅片磨床进给系统的结构特点,确定了进给系统的结构方案;应用工程设计软件Pro/Engineer,建立了硅片磨床进给系统的三维模型;提出了硅片磨床进给系统的超精密定位和速度控制方案;提出了以虚拟样机技术和运动控制仿真为核心的技术路线和研究方案。3.应用有限元分析软件ANSYS分析了关键零件滚珠丝杠的模态;在虚拟样机软件ADAMS中建立了刚柔耦合的进给系统模型,分析了进给系统的运动学特性。4.综合考虑了丝杠柔性化和接触刚度阻尼对系统振动性能的影响,计算了丝杠螺母的接触刚度、导轨滑块的接触刚度和丝杠轴承的接触刚度等;分析了磨床进给系统的受迫振动情况和受迫激振源,利用ADAMS/Vibration模块对进给系统的刚柔耦合模型进行了振动分析,获得了系统模态分布及砂轮的频响函数。5.设计了基于ADAMS和MATLAB/Simulink的机电协同仿真方案,建立了进给系统控制环节的数学模型,推导了各环节的传递函数模型,创建了进给伺服系统的机电协同仿真模型,并通过响应波形对控制系统的PID参数进行整定;对进给系统的低速进给工况进行了仿真分析,验证了设计方案的可行性。
    Silicon wafer is an important substrate material of IC chips manufacture. During the process to turn silicon ingot into the integrated circuit chips,ultra-precision grinding is mainly used in planarization for in silicon wafer preparation and back thinning in the backend of semiconductor manufacturing process. With the development of high intergration and performance, there is a new challenge for ultra-precision wafer grinder to get both supersmooth surface without scathe and grinding efficiency.The ultra-precision feeding system is the key part of wafer grinder,and also a kind of mechano-electronic product.lt must have good structure static and dynamic performance to improve the processability and kinematic accuracy.This paper analysed the dynamic performance of the feeding system with virtual prototype, finite element analysis and electromechanical collaborative simulation technology.The main contents of the paper are as following.Firstly,this paper introduced the research situation of wafer grinder,the performance requirement of feeding system and the research situation and development trend of electromechanical collaborative simulation technology and virtual prototype technology.Secondly,this paper analysed the structure feature of feeding system, decided the structure designment;established the feeding system model of wafer grinder with Pro/Engineer;designed ultraprecision positioning and speed control program.Thirdly, this paper analysed the modal of ballscrew as the key part with ANSYS established a rigid-flexible multi-body dynamics model for feeding system in the virtual prototype software ADAMS, and analysed the movement characterstics of the feeding system.Fourthly,this paper intergratedly considered the influence come from flexible screw and contact stiffness,calculated the contact stiffness between screw and nut,guide and slide block,screw and bearing;analysed the forced vibration source of the feeding system,made vibration simulation analysis based on the rigid-flexible multi-body model with ADAMS/Vibration,and got vibration modes of the system and the frequency response function at the grinding wheel.Finally,this paper designed the electromechanical collaborative simulation program based on ADAMS and MATLAB/Simulink,established the math model of servo control link,deduced the transfer function of the control loop,set up the model of the feeding system for electromechanical co-simulation,and tuned PID parameters of the control link with response waveform; simulated the feed movement at low speed and verified the feasibility of the feeding system designed.
        

基于虚拟样机技术的硅片磨床进给系统机电协同仿真

摘要4-5
Abstract5-6
1 绪论9-18
    1.1 硅片磨床的研究现状9-10
    1.2 硅片磨床进给系统的结构特点与性能要求10-11
    1.3 硅片磨床进给系统的性能要求11
    1.4 虚拟样机仿真技术及应用11-15
        1.4.1 传统模式与现代模式的产品开发过程12-13
        1.4.2 数字化虚拟样机技术应用现状13-14
        1.4.3 机电协同仿真技术的现状14-15
    1.5 课题背景及意义15-16
    1.6 本论文主要研究内容16-18
2 硅片磨床进给系统刚柔耦合模型18-41
    2.1 多体动力学18-19
        2.1.1 多刚体系统动力学18-19
        2.1.2 多柔体系统动力学19
    2.2 虚拟样机刚柔耦合模型19-23
        2.2.1 多刚体模型创建工具及流程19-20
        2.2.2 柔性体模型创建工具及流程20-22
        2.2.3 刚柔耦合模型创建流程22-23
    2.3 硅片磨床进给系统的结构组成23-25
        2.3.1 硅片磨床进给系统工作原理23-24
        2.3.2 硅片磨床进给系统的设计性能参数24-25
    2.4 硅片磨床进给系统刚柔耦合模型的创建25-40
        2.4.1 硅片磨床进给系统三维模型的创建25-26
        2.4.2 刚性进给系统的模型26-32
        2.4.3 细长件丝杠的有限元模态分析32-36
        2.4.4 刚柔耦合的进给系统的模型36-37
        2.4.5 模型仿真结果37-40
    2.5 本章小结40-41
3 基于Adams的硅片磨床进给系统振动分析41-56
    3.1 振动分析简介与流程41-44
        3.1.1 机床的振动41
        3.1.2 硅片磨床进给系统的振源41-42
        3.1.3 振动分析基础42-44
    3.2 硅片磨床进给系统振动模型的创建44-47
        3.2.1 ADAMS振动分析流程44-45
        3.2.2 进给系统振动模型45-47
        3.2.3 进给系统振动模型输入和输出通道的定义47
    3.3 硅片磨床进给系统振动仿真及分析47-55
    3.4 本章小结55-56
4 超精密进给系统的机电协同仿真56-79
    4.1 Adams/Simulink联合仿真技术56-59
        4.1.1 MATLAB/Simulink概述57-58
        4.1.2 ADAMS/MATLAB接口原理与设计58-59
    4.2 硅片磨床进给伺服驱动系统59-66
        4.2.1 伺服驱动系统的结构组成59-60
        4.2.2 永磁交流同步伺服电机数学模型60-63
        4.2.3 伺服控制环节传递函数63-66
    4.3 机电协同仿真66-78
        4.3.1 ADAMS机械传动输出至MATLAB/Simulink66-67
        4.3.2 MATLAB/Simulink中创建模型67-68
        4.3.3 基于阶跃响应的PID参数整定68-75
        4.3.4 低速进给的机电协同仿真分析75-78
    4.4 本章小结78-79
5 总结与展望79-81
    5.1 全文工作总结79-80
    5.2 不足与展望80-81
参考文献81-84
攻读硕士学位期间发表学术论文情况84-85
致谢85-87
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