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MEMS引信保险装置的制作及铸层结合强度研究

The Fabrication of MEMS Fuze Safety Device and the Study on Bonding Strength of Electroforming Layer

作者: 专业:微机电工程 导师:杜立群 年度:2010 学位:硕士  院校: 大连理工大学

Keywords

MEMS fuze safety device, UV-LIGA technology, micro electroforming, bonding strength, scratch test

        随着MEMS技术的发展和广泛应用,MEMS引信安全保险装置的发展非常迅速,在一些引信类型中必然将取代传统的机械式安全保险机构。对于高性能的引信,有效地控制体积是非常重要的。MEMS引信安全保险装置的出现解决了这一问题,它比传统引信保险装置小很多,使得常规引信有更多的空间容纳多传感器探测电路和主装药,提高了弹药的精确度和杀伤力。除此之外,MEMS引信安全保险装置还具有质量轻、成本低、强度好、可靠性高等诸多优点。本文通过对现有的MEMS引信制作工艺进行分析,提出了一种新的基于UV-LIGA工艺的MEMS引信安全保险装置制作方法,这种方法组合了SU-8胶厚胶光刻工艺、微电铸工艺、无背板生长工艺和牺牲层工艺。利用这种方法本文直接在金属基底上制作了两类双层大位移可动结构。由于采用了UV-LIGA工艺和无背板生长工艺,缩短了加工周期,节约了成本。所制作的器件最小线宽达到了40μm,满足尺寸设计的要求。此外,器件在冲击脉冲20000g,持续时间150 u s的条件下进行了冲击试验,试验后保存完好,满足强度的要求。同时在制作过程中解决了SU-8胶胶模制作、微结构生长和铸层应力的控制、可动结构释放、牺牲层去除等相关问题。为这一类器件的制作提供了有用的工艺借鉴。针对MEMS工艺过程中出现的微电铸铸层结合强度低的问题,本文分析了铸层的形成机理,讨论了铸层结合强度的影响因素。在对膜基结合力的测量方法进行分析比较后,选用划痕法对不同电流密度下铸层与基底的结合强度进行了测量,并对测量结果进行了分析,为提高铸层的结合强度打下基础。
    With the development and wide application of MEMS technology, MEMS fuze safety device is developing very quickly. It tends to replace the traditional mechanical fuze safety device in large field. In order to obtain a high-performance fuze, it is very important to control the volume effectively. The MEMS fuze safety device can satisfy the requirement perfectly. It is much smaller than traditional one, therefore the fuze can have more space for the multi-sensor detection circuit and the main charge, and the fuze accuracy and destructive power will be greatly improved. In addition, The MEMS fuze safety device takes many other advantages which have attracted considerable interests, such as low cost, small weight, high strength and high reliability.In this paper, comparing the existing technologies in fabricating MEMS fuze safety device, a new micro fabrication method of metal-based fuze MEMS safety device is presented based on UV-LIGA technology. The method consists of SU-8 thick photoresist lithography process, micro electroforming process, no back plate growing process and SU-8 photoresist sacrificial layer process. Two kinds of double-layer moveable metal devices have been fabricated on metal substrates directly with the method. Because UV-LIGA technology and no back plate growing technology were introduced, the production cycle was shortened and the cost was reduced. The smallest dimension of the devices is 40μm, which met the requirement of size. To evaluate the adhesion property between electroforming deposit layer and substrate qualitatively, the impact experiments have been done on the device samples. The samples were still in good condition and workable after undergoing impact pulses with 20,000g peak and 150μs duration and completely met the requirement of strength. Besides, six problems in the fabrication process have been solved effectively, which is helpful for the fabrication of similar kinds of micro devices. The fabrication method presented in the paper provides a new option for the development of MEMS fuze.Besides, the mechanism of electroforming and the factors that influence the bonding strength of electroforming layers have been discussed. Comparing different testing method of film-substrate bonding strength, scratch tests have been done to evaluate the bonding strength of Ni layers, and the samples were electroformed under different current density. The result has been discussed, which made a preparation for the further work.
        

MEMS引信保险装置的制作及铸层结合强度研究

摘要5-6
Abstract6
1 绪论10-16
    1.1 MEMS引信的发展10-13
        1.1.1 MEMS引信的研究现状11-12
        1.1.2 MEMS引信的制作技术综述12-13
    1.2 微电铸过程中的铸层结合力13-15
        1.2.1 铸层存在结合力差的问题13-14
        1.2.2 铸层结合力的研究现状14-15
    1.3 课题研究内容15-16
2 MEMS引信安全保险装置制作关键技术16-24
    2.1 SU-8胶厚胶光刻技术16-17
    2.2 微电铸工艺17-19
    2.3 无背板生长工艺19-20
    2.4 牺牲层工艺20-23
    2.5 本章小结23-24
3 MEMS引信安全保险装置制作方法24-37
    3.1 制作材料及设备24
    3.2 工艺流程24-32
        3.2.1 电热驱动微结构的制作24-29
        3.2.2 电磁驱动微结构的制作29-30
        3.2.3 结构尺寸的测量及冲击试验30-32
    3.3 制作过程中的工艺问题32-35
        3.3.1 SU-8胶与基底结合力差的问题32
        3.3.2 胶膜不平整以及胶层中的气泡问题32-33
        3.3.3 铸层结合力问题33
        3.3.4 铸层缺陷问题33-34
        3.3.5 SU-8胶去除问题34
        3.3.6 多层电铸工艺34-35
    3.4 电铸机夹具改进35-36
    3.5 本章小结36-37
4 微电铸铸层结合强度的研究37-53
    4.1 铸层的形成过程37
    4.2 铸层与基底的结合机理37-38
    4.3 微电铸过程中铸层结合力影响因素38-40
    4.4 铸层结合力的测量40-47
        4.4.1 铸层结合力的测量方法40-45
        4.4.2 结合强度的表征45-47
    4.5 结合强度测量实验47-52
        4.5.1 实验材料及设备47
        4.5.2 样品制备47-48
        4.5.3 划痕实验48
        4.5.4 结果与讨论48-52
    4.6 本章小结52-53
结论53-54
参考文献54-59
攻读硕士学位期间学术论文发表情况59-60
致谢60-62
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